Job Listing

JOB DESCRIPTION

Purpose & Position Summary

Leading technology development engineers for new technology products development from Proof Of Concept generation, Feasibility Studies, and Industrialization toward Technology Qual and/or Product Qual. The Manager is expected to be equipped with a knowledge of IC packaging to understand the technology trends of advanced IC packaging.

Responsibilities

• Develop, drive the packaging and technology roadmap that meets future business/customer requirements and increase the organization’s competitive position
• Responsible for the package design, design verification, and simulations.
• Drive new packaging materials research, responsible for characterization, application, and selection.
• Able to work independently to explore, research, develop new packaging/assembly technology that meeting the package roadmap and responsible to establish the processes.
• Able to execute independently BOM (Bill of Material) project for New Technology Products and processes.
• Able to work intensively relating to Project Management and Design For Manufacturing (DFM) and Design For Reliability (DFR).
• Leading projects to implement new technology realization by setting up project framework, team formation, initiate budgets, communication, and milestone/cost tracking.
• Manage the development of assembly equipment infrastructure and solutions to meet the new production needs of the company.
• Lead and liaise with internal customers to plan, execute, and review the result on engineering activities for product bring up.
• Accountable in overseeing (End to end) and provide direction to the entire execution of the project technically.
• Drive individual engineering team on qualification of equipment for product bring up
• Work with various process and equipment team in defining the new product requirement and support customer technical request.
• Provide update in various forum to keep stakeholder aware of the latest development status on the new technology bring up
• Communicates with team members so that all goals, expectations and performance as compared to plans are well understood.
• Train, develop and retain team member with at least one back up for each critical position
• Provide forecast and manage budget requirements to bring up the new product.

Requirements

• Bachelor’s/Master/PhD degree in engineering with min. 10 years of relevant industry experience, and more than 7 years managing and leading a department/ team
• Must have Advanced IC Packaging assembly experience including project managing for customer 
• Knowledge and experience in advanced packaging with technology industrialization and product realization etc.
• Vast experience and in-depth knowledge of leading-edge advanced packaging equipment/tool
• Candidate with Project Management skill or NPI background would be a distinct advantage.
• Strong in planning, statistical, analytical skills and systematic problem-solving skills.
• Work independently and good communication / interpersonal skill to liaise with cross-functional departments.
• Good attitude, good work ethic and a fast learner.