Job Listing
Company
Anonymous
Industry
Semiconductors
Location
Pulau Pinang
Company Description
Our Client is a Leading OSAT MNC providing WLCSP Services, Wafer Backgrind (WBG), Die Prep Services (DPS), Final Test and Wafer Sort and other related services.Director, Product Development Engineering
Anonymous
| Salary Budget: | Please log into your account to check the details. |
|---|---|
| Job Type: | Permanent |
| Location: | Pulau Pinang |
| Special Requirements: |
Rewards
| Posting Date: | 03-14-2021 |
|---|---|
| Expiry Date: | 12-31-2021 |
JOB DESCRIPTION
Responsibilities
- This position requires strong technology, product/program management skills, and business acumen to drive/deliver critical technology milestones to optimize the PBGA/CSP/SCSP/FBGA product manufacturability for good quality and production performance.
- Responsible for establishing & benchmarking Technology Roadmap.
- Work with customers for industry-standard leading-edge engineering & equipment solutions.
- Bump process knowledge includes Solder & Cu-Pillar Bump.
- Wafer Fab process experience would be an advantage.
- Drive successful Assembly Enablement for New Products.
- Responsible for Assembly Technical Program Customer Interface.
- Drive Assembly Process Development.
- Drive Yield & Quality improvement for NPI & High Volume Manufacturing (HVM).
- Process Setup & Buyoff for New Equipment.
- Work with cross-functional teams including ATMP engineering, quality, and Customer Engineering teams to develop a solution or provide simulations for customers in order to gain customer satisfaction and facilitate the success of product launch.
Requirements
- PhD/Master's/Bachelor's degree in relevant fields.
- Strong knowledge and experience in:
- Packaging FCBGA/Flip Chip package development
- Bumping development
- Developed raw material like Epoxy, Underfill, TIM and Solder ball, Solder paste & Flux
- IC packaging/bumping process and new package development /transfer procedure.