Job Listing

Company
Anonymous
Industry
Electrical/Electronic Manufacturing
Location
Kedah
Company Description
Our Client is a Leading MNC providing Thermal Solutions to the Semiconductor and other industries.Senior Process Engineer (Bonding)
Anonymous
Salary Budget: | Please log into your account to check the details. |
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Job Type: | Permanent |
Location: | Kedah |
Special Requirements: |
Rewards
Posting Date: | 09-05-2025 |
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Expiry Date: | 12-31-2025 |
JOB DESCRIPTION
Key Responsibilities:
· Design, develop, and validate Elastomer Material and Bonding processes (e.g., rubber-to-metal, rubber-to-plastic);
· Select and evaluate adhesives, primers, and elastomer compounds for compatibility and performance;
· Develop surface preparation protocols (e.g., cleaning, roughening, chemical treatments, plasma) to optimize adhesion;
· Characterize bonded joints through mechanical testing (peel, shear, tensile, fatigue) and thermal/environmental aging studies;
· Support scale-up from prototype to production, including process documentation, tooling design input, and operator training;
· Collaborate with materials scientists, design engineers, and quality teams to ensure robust, repeatable bonding;
· Investigate bonding failures using root cause analysis and recommend corrective actions;
· Ensure compliance with applicable standards (e.g., ASTM, ISO) and customer requirements;
· Stay current with advancements in elastomeric materials, adhesives, and bonding technologies.
Required Qualifications:
· Bachelor’s degree in Materials Science, Chemical Engineering or related technical field are preferred;
· 5 to 8 years of experience in Elastomer Material and Bonding or adhesive technologies in automotive, aerospace, medical device, semiconductor, or industrial manufacturing;
· Familiarity with elastomer formulations (EPDM, NBR, FKM, silicone, etc.) and adhesive systems (epoxy, urethane, acrylic, etc.);
· Strong knowledge of surface science and adhesion mechanisms;
· Experience with Elastomer Material and Bonding process development, DOE, and SPC tools;
· Hands-on experience with mechanical testing and failure analysis of bonded assemblies;
· Proficient in technical documentation and communication of complex findings;
· Familiarity with FMEA, control plans, and PPAP (if in regulated industries);
· Knowledge of mold-in bonding and over-molding techniques;
· Experience with automation or robotic application of adhesives;
· Must be willing to work in Kulim High Tech Park, Kedah.
· Will be required to travel to US.