Company

Anonymous

Industry

Electrical/Electronic Manufacturing

Location

Kedah

Company Description
Our Client is a Leading MNC providing Thermal Solutions to the Semiconductor and other industries.

Senior Process Engineer (Bonding)

Anonymous

Salary Budget: Please log into your account to check the details.
Job Type: Permanent
Location: Kedah
Special Requirements:

Rewards

Referral
CV Offer: USD70
Contact Offer: USD35
Placement
CV Offer: USD840
Contact Offer: USD210
Posting Date: 09-05-2025
Expiry Date: 12-31-2025

JOB DESCRIPTION

Key Responsibilities:

·  Design, develop, and validate Elastomer Material and Bonding processes (e.g., rubber-to-metal, rubber-to-plastic);

·  Select and evaluate adhesives, primers, and elastomer compounds for compatibility and performance;

·  Develop surface preparation protocols (e.g., cleaning, roughening, chemical treatments, plasma) to optimize adhesion;

·  Characterize bonded joints through mechanical testing (peel, shear, tensile, fatigue) and thermal/environmental aging studies;

·  Support scale-up from prototype to production, including process documentation, tooling design input, and operator training;

·  Collaborate with materials scientists, design engineers, and quality teams to ensure robust, repeatable bonding;

·  Investigate bonding failures using root cause analysis and recommend corrective actions;

·  Ensure compliance with applicable standards (e.g., ASTM, ISO) and customer requirements;

·  Stay current with advancements in elastomeric materials, adhesives, and bonding technologies.

Required Qualifications:

·  Bachelor’s degree in Materials Science, Chemical Engineering or related technical field are preferred;

·  5 to 8 years of experience in Elastomer Material and Bonding or adhesive technologies in automotive, aerospace, medical device, semiconductor, or industrial manufacturing;

·  Familiarity with elastomer formulations (EPDM, NBR, FKM, silicone, etc.) and adhesive systems (epoxy, urethane, acrylic, etc.);

·  Strong knowledge of surface science and adhesion mechanisms;

·  Experience with Elastomer Material and Bonding process development, DOE, and SPC tools;

·  Hands-on experience with mechanical testing and failure analysis of bonded assemblies;

·  Proficient in technical documentation and communication of complex findings;

·  Familiarity with FMEA, control plans, and PPAP (if in regulated industries);

·  Knowledge of mold-in bonding and over-molding techniques;

·  Experience with automation or robotic application of adhesives;

·  Must be willing to work in Kulim High Tech Park, Kedah.

·  Will be required to travel to US.


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